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document number: mpl115a2 rev. 9, 02/2013 freescale semiconductor data sheet: technical data ? 2009-2013 freescale semiconducto r, inc. all ri ghts reserved. miniature i 2 c digital barometer the mpl115a2 is an absolute pressure sensor with a digital i 2 c output targeting low cost applications. a mini ature 5 x 3 x 1.2 mm lga pa ckage is ideally suited for the space constrained requirements of portable electronic devices. low current consumptions of 5 a during active mode and 1 a during shutdown (sleep) mode are essential when focusing on low-power applications. the wide operating temperature range spans from -40c to +105c to fit demanding environmental conditions. the mpl115a2 employs a mems pressure sensor with a conditioning ic to provide accurate pressure measurement s from 50 to 115 kpa. an integrated adc converts pressure and temperature sensor readings to digitized outputs via a i 2 c port. factory calibration data is stored internally in an on-board rom. utilizing the raw sensor output and calib ration data, the host microcontroller executes a compensation algorithm to render compensated absolute pressure with 1 kpa accuracy. the mpl115a2 pressure sensor?s small form factor, low power capability, precision, and digital output optimize it for barometric measurement applications. features ? digitized pressure and temperature information together with programmed calibration coefficients for host micro use. ? factory calibrated ? 50 kpa to 115 kpa absolute pressure ? 1 kpa accuracy ? 2.375v to 5.5v supply ? integrated adc ?i 2 c interface (operates up to 400 khz) ?7-bit i 2 c address = 0x60 ? monotonic pressure and temperature data outputs ? surface mount rohs compliant package application examples ? barometry (portable and desktop) ? altimeters ? weather stations ? hard-disk drives (hdd) ? industrial equipment ? health monitoring ? air control systems ordering information device name package options case no. # of ports pressure type digital interface none single dual gauge differential absolute mpl115a2 tray 2015 ? ? i 2 c mpl115a2t1 tape & reel (1000) 2015 ? ? i 2 c mpl115a2 50 to 115 kpa top view mpl115a2 5.0 mm x 3.0 mm x 1.2 mm pin connections 1 nc sda vdd cap shdn gnd rst scl 2 3 4 8 7 6 5
sensors 2 freescale semiconductor, inc. mpl115a2 1 block diagram and pin descriptions figure 1. block diagram and pin connections table 1. pin description pin name function 1 vdd vdd power supply connection: vdd range is 2.375v to 5.5v. 2 cap 1 f connected to ground. 3 gnd ground 4 shdn shutdown: connect to gnd to disable the device. when in shutdown, the part draws no more than 1 a supply current and all communications pins (rst , scl, sda) are high impedance. connect to vdd for normal operation. 5 rst reset: connect to ground to disable i 2 c communications. 6 nc nc: no connection 7 sda (1) 1. use 4.7k pullup resistors for i 2 c communication. sda: serial data i/o line 8 scl (1) i 2 c serial clock input. diff amp temp sensor mux adc scl gnd vdd sda temperature pressure coefficient storage addr addr addr addr addr i 2 c interface shdn rst cap diff amp temp sensor mux adc scl gnd vdd sda temperature pressure coefficient storage addr addr addr addr addr addr addr addr i 2 c interface shdn rst cap vdd cap shdn sda rst gnd scl c 1 f 1 f microcontroller 4.7 k 4.7 k
sensors freescale semiconductor, inc. 3 mpl115a2 2 mechanical and elect rical specifications 2.1 maximum ratings voltage (with respect to gn d unless otherwise noted) v dd ..................................................................................................................... -0.3 v to +5.5 v shdn , rst, sda, scl ...............................................................................-0.3 v to v dd +0.3 v operating temperature range .......................................................................... -40c to +105c storage temperature range ............................................................................. -40c to +125c overpressure................................................................................................................ 100 0 kpa 2.2 operating characteristics v dd = 2.375 v to 5.5 v, t a = -40c to +105c, unless otherwise noted. typical values are at v dd = 3.3 v, t a = +25c. ref parameters symbol conditions min typ max units 1 operating supply voltage v dd 2.375 3.3 5.5 v 2 supply current i dd shutdown (shdn = gnd) ? ? 1 a standby ? 3.5 10 a average ? at one measurement per second ? 5 6 a pressure sensor 3 range 50 ? 115 kpa 4 resolution ?0.15?kpa 5 accuracy -20oc to 85oc ? ? 1 kpa 6 power supply rejection typical operating circuit at dc 0.1 ? kpa/v 100 mv p-p 217 hz square wave plus 100 mv pseudo random noise with 10 mhz bandwidth 0.1 ? kpa 7 conversion time (start pressure and temperature conversion ) tc time between start convert command and data available in the pressure and temperature registers ?1.63 ms 8 wakeup time tw time between leaving shutdown mode (shdn goes high) and communicating with the device to issue a command or read data. ?35ms i 2 c i/o stages: scl, sda 9 scl clock frequency f scl ? ? 400 khz 10 low level input voltage vil ??0.3v dd v 11 high level input voltage vih 0.7v dd ?? v i 2 c outputs: sda 12 data setup time t su setup time from command receipt to ready to transmit 0?0.4s i 2 c addressing mpl115a2 uses 7-bit addressing, does not acknowledge the general call address 0000000. slave address has been set to 0x60 or 11 00000.
sensors 4 freescale semiconductor, inc. mpl115a2 3 overview of functions/operation figure 2. sequence flow chart the mpl115a interfaces to a host (or system) microcontroller in the user?s application. all communications are via i 2 c. a typical usage sequence is as follows: initial power-up all circuit elements are active. i 2 c port pins are high impedance and associated registers are cleared. the device then enters standby mode. reading coefficient data the user then typically accesses the part and reads the coefficien t data. the main circuits within the slave device are disable d during read activity. the coefficients are usually stored in the host microcontoller local memory but can be re-read at any tim e. it is not necessary to read the values stored in the host microc ontroller multiple times because the coefficients within a devi ce are constant and do not change. however, note that the coefficient s will be different from device to device, and cannot be used for another part. data conversion this is the first step that is performed each time a new pressure reading is required which is initiated by the host sending th e convert command. the main system circuits are activated (w ake) in response to the command and after the conversion completes, the result is placed into the pr essure and temperatur e adc output registers. the conversion completes within the maximum conversion time, tc (see row 7 , in the operating characteristics table). the device then enters standby mode. compensated pressure reading after the conversion has been given sufficient time to complete, the host microcontroller reads the result from the adc output registers and calculates the compensated pressure, a barome tric/atmospheric pressure value which is compensated for changes in temperature and pressure sensor linearity. this is done using the coefficient data from the mpl115a and the raw sampled pressure and temperature adc output values, in a compensa tion equation (detailed later). note that this is an absolute pressure measurement with a vacuum as a reference. from this step the host controller may either wait and then retu rn to the data conversion step to obtain the next pressure read ing or it may go to the shutdown step. reading coefficient data data conversion initial powerup compensated pressure reading shutdown
sensors freescale semiconductor, inc. 5 mpl115a2 shutdown for longer periods of inactivity the user may assert the shdn input by driving this pin low to reduce system power consumption. this removes power from all internal circuits, including any re gisters. in the shutdown state, the pressure and temperature registers will be reset, losing any previous adc output values. this step is exited by taking the shdn pin high. wait for the maximum wakeup time, tw (see row 8 , in the operating characteristics table), after which another pressure reading can be taken by transitioning to the data conversion step. for values with less than 16 bits, the lower lsbs are zero. for ex ample, c12 is 14 bits and is stored into 2 bytes as follows: c12 ms byte = c12[13:6] = [c12 b13 , c12 b12 , c12 b11 , c12 b10 , c12 b9 , c12 b8 , c12 b7 , c12 b6 ] c12 ls byte = c12[5:0] & ?00? = [c12 b5 , c12 b4 , c12 b3 , c12 b2 , c12 b1 , c12 b0 , 0 , 0] 3.1 pressure, temperature and coef ficient bit-width specifications the table below specifies the initial coefficient bit-width spec ifications for the compensation algorithm and the specification s for pressure and temperature adc values. table 2. device memory map address name description size (bits) 0x00 padc_msb 10-bit pressure adc output value msb 8 0x01 padc_lsb 10-bit pressure adc output value lsb 2 0x02 tadc_msb 10-bit temperature adc output value msb 8 0x03 tacd_lsb 10-bit temperature adc output value lsb 2 0x04 a0_msb a0 coefficient msb 8 0x05 a0_lsb a0 coefficient lsb 8 0x06 b1_msb b1 coefficient msb 8 0x07 b1_lsb b1 coefficient lsb 8 0x08 b2_msb b2 coefficient msb 8 0x09 b2_lsb b2 coefficient lsb 8 0x0a c12_msb c12 coefficient msb 8 0x0b c12_lsb c12 coefficient lsb 8 0x0c reserved* ? ? 0x0d reserved* ? ? 0x0e reserved* ? ? 0x0f reserved* ? ? 0x10 reserved ? ? 0x11 reserved ? ? 0x12 convert start pressure and temperature conversion ? *these registers are set to 0x00. these are reserved, and we re previously utilized as coefficient values, c11 and c22, which were always 0x00. pressure, temperature and compensation coefficient specifications a0 b1 b2 c12 padc tadc total bits 16 16 16 14 10 10 sign bits 1 1 1 1 0 0 integer bits 12 2 1 0 10 10 fractional bits 3 13 14 13 0 0 dec pt zero pad 0 0 0 9 0 0
sensors 6 freescale semiconductor, inc. mpl115a2 example binary format definitions: a0 signed, integer bits = 12, fractional bits = 3 : coeff a0 = s i 11 i 10 i 9 i 8 i 7 i 6 i 5 i 4 i 3 i 2 i 1 i 0 . f 2 f 1 f 0 b1 signed, integer bits = 2, fractional bits = 13 : coeff b1 = s i 1 i 0 . f 12 f 11 f 10 f 9 f 8 f 7 f 6 f 5 f 4 f 3 f 2 f 1 f 0 b2 signed, integer bits = 1, fractional bits = 14 : coeff b2 = s i 0 . f 13 f 12 f 11 f 10 f 9 f 8 f 7 f 6 f 5 f 4 f 3 f 2 f 1 f 0 c12 signed, integer bits = 0, fractional bits = 13, dec pt zero pad = 9 : coeff c12 = s 0 . 000 000 000 f 12 f 11 f 10 f 9 f 8 f 7 f 6 f 5 f 4 f 3 f 2 f 1 f 0 padc unsigned, integer bits = 10 : padc u = i 9 i 8 i 7 i 6 i 5 i 4 i 3 i 2 i 1 i 0 tadc unsigned, integer bits =10 : tadc u = i 9 i 8 i 7 i 6 i 5 i 4 i 3 i 2 i 1 i 0 note: negative coefficients are coded in 2?s complement notation. 3.2 compensation the 10-bit compensated pressure output, pcomp, is calculated as follows: eqn. 1 where: padc is the 10-bit pressure adc output of the mpl115a tadc is the 10-bit temperatur e adc output of the mpl115a a0 is the pressure offset coefficient b1 is the pressure sensitivity coefficient b2 is the temperature coefficient of offset (tco) c12 is the temperature coefficient of sensitivity (tcs) pcomp will produce a value of 0 with an inpu t pressure of 50 kpa and will produce a full-scale value of 1023 with an input pres sure of 115 kpa. eqn. 2 3.3 evaluation sequence, arithmetic circuits the following is an example of the calculation for pcomp, the compensated pressure output. input values are in bold. c12x2 = c12 * tadc a1 = b1 + c12x2 a1x1 = a1 * padc y1 = a0 + a1x1 a2x2 = b2 * tadc pcomp = y1 + a2x2 this can be calculated as a succession of mult iply accumulates (macs) operations of the form y = a + b * x: pcomp a0 b1 c12 tadc + () padc b2 tadc + += pressure (kpa) p =comp 115 50 ? 1023 ---------------------- 50 + a b x y + x
sensors freescale semiconductor, inc. 7 mpl115a2 the polynomial can be evaluated ( equation 1 ) as a sequence of 3 macs: please refer to freescale application note an3785 for more detailed notes on implementation. 3.4 i 2 c device read/write operations all device read/write operations are memory mapped. device acti ons e.g. ?start conversions? ar e controlled by writing to the appropriate memory address location. ?for i 2 c the 7-bit device address (from table 2) has a read/write toggle bit, where the least significant bit is ?1? for read operations or ?0? for wr ite operations. the device address is 0xc0 for a write and the device address is 0xc1 for a read . ? the most significant bit in the command tables below is not us ed and is don't care (x). in examples given it?s set to ?0?. refer to sensor i 2 c setup and faq application note an4481 for more information on i 2 c communication between the sensor and host controller. x = don?t care 1 = the command byte needs to be paired with a 0x00 as part of the i 2 c exchange to complete the passing of start conversions. table 3. i 2 c write commands command binary hex (1) devices address + write bit 1100 0000 0xc0 start conversions x001 0010 0x12 pcomp a0 b1 c12 tadc ? + () padc b2 tadc ? + ? += b1 c12 tadc a0 b2 tadc padc a1 y1 y pcomp
sensors 8 freescale semiconductor, inc. mpl115a2 the actions taken by the part in response to each command are as follows: x = don?t care these are mpl115a2 i 2 c commands to read coefficients, execute pressure a nd temperature conversions, and to read pressure and temperature data. the sequence of the commands for the interaction is given as an example to operate the mpl115a2. utilizing this gathered data, an example of the calculating the compensated pressure reading is given in floating point notatio n. i 2 c commands (simplified for communication) device address + write bit ?to write? = 0xc0 device address + read bit ?to read? = 0xc1 command to write ?convert pressure and temperature? = 0x12 command to read ?pressure adc high byte? = 0x00 command to read ?pressure adc low byte? = 0x01 command to read ?temperature adc high byte? = 0x02 command to read ?temperature adc low byte? = 0x03 command to read ?coefficient data byte 1 high byte? = 0x04 read coefficients: [0xc0], [0x04], [0xc1], [0x3e] , [0xce], [0xb3], [0xf9], [0xc5], [0x17], [0x33], [0xc8] figure 3. i 2 c read coefficient datagram table 4. i 2 c write command description command action taken start conversions wake main circuits. start clock. allow supply stabilization time. select pressure sensor input. appl y positive sensor excitation and perform a to d conversion. select temperatur e input. perform a to d conversion. load the pressure and temperature registers with the result. shut down main circuits and clock. table 5. i 2 c read command description command binary hex (1) device address + read bit 1100 0001 0xc1 read pressure msb x000 0000 0x00 read pressure lsb x000 0001 0x01 read temperature msb x000 0010 0x02 read temperature lsb x000 0011 0x03 read coefficient data byte 1 x000 0100 0x04
sensors freescale semiconductor, inc. 9 mpl115a2 figure 4. i 2 c start conversion datagram command to i 2 c start conversion, 0x12 figure 5. i 2 c read results datagram a0 coefficient msb = 0x3e a0 coefficient lsb = 0xce a0 coefficient = 0x3ece = 2009.75 b1 coefficient msb = 0xb3 b1 coefficient lsb = 0xf9 b1 coefficient = 0xb3f9 = -2.37585 b2 coefficient msb = 0xc5 b2 coefficient lsb = 0x17 b2 coefficient = 0xc517 = -0.92047 c12 coefficient msb = 0x33 c12 coefficient lsb = 0xc8 c12 coefficient = 0x33c8 = 0.000790 pressure msb = 0x66 pressure lsb = 0x80 pressure = 0x6680 = 0110 0110 1100 0000 = 410 adc counts temperature msb = 0x7e temperature lsb = 0xc0 temperature = 0x7ec0 = 0111 1110 1100 0000 = 507 adc counts
sensors 10 freescale semiconductor, inc. mpl115a2 3.5 example of pressure compensated calc ulation in floating-point notation pressure compensation: using the evaluation sequence shown in section 3.3: 4 solder recommendations 1. use sac solder alloy (i.e., sn-ag-cu) with a melting point of about 217c. it is recommended to use sac305 (i.e., sn-3.0 wt.% ag-0.5 wt.% cu). 2. reflow ? ramp up rate: 2 to 3c/s. ? preheat flat (soak): 110 to 130s. ? reflow peak temperature: 250 c to 260c (depends on exact sac alloy composition). ? time above 217c: 40 to 90s (depends on board type, thermal mass of the board/ quantities in the reflow). ? ramp down: 5 to 6c/s. ? using an inert reflow environment (with o 2 level about 5 to 15 ppm). a0 coefficient = 2009.75 b1 coefficient = -2.37585 b2 coefficient = -0.92047 c12 coefficient = 0.000790 pressure = 410 adc counts temperature = 507 adc counts c12x2 = c12 * tadc = 0.000790 * 507 = 0.40053 a1 = b1 + c12x2 = -2.37585 + 0.40053 = -1.97532 a1x1 = a1 * padc = -1.97532 * 410 = -809.8812 y1 = a0 + a1x1 = 2009.75 + (-809.8812) = 1199.8688 a2x2 = b2 * tadc = -0.92047 * 507 = -466.67829 pcomp = y1 + a2x2 = 1199.8688 + (-466.67829) = 733.19051 pcomp a0 b1 c12 tadc ? + () padc b c () + ? += pressure (kpa) p =comp 115 50 ? 1023 ---------------------- 50 + ? 733.19 = 115 50 ? 1023 ---------------------- 50 + ? 96.59kpa =
sensors freescale semiconductor, inc. 11 mpl115a2 note: the stress level and signal offset of the device also depen ds on the board type, board core material, board thickness and metal finishing of the board. please refer to freescale application note an3150, soldering recommendations for pressure sensor devices for any additional information.
sensors 12 freescale semiconductor, inc. mpl115a2 5 handling recommendations it is recommended to handle the mpl115a pressure sensor with a vacuum pick and place tool. sharp objects utilized to move the mpl115a pressure sensor increase the possibility of da mage via a foreign object/tool into the small exposed port. the sensor die is sensitive to light exposure. direct light exposure through the port hole can lead to varied accuracy of press ure measurement. avoid such exposure to the port during normal operation. please note that the pin 1 designator is on the bottom of the pack age. do not use the port as a orientation reference in produc tion. 6 soldering/landing pad information the lga package is compliant with the rohs standard. it is recommended to use a no-clean solder paste to reduce cleaning exposure to high pressure and chemical agents that can dam age or reduce life span of the pressure sensing element. figure 6. mpl115a2 recommended pcb landing pattern
sensors 13 freescale semiconductor, inc. mpl115a2 7 tape and reel specifications figure 7. lga (3 x 5) embossed carrier tape dimensions figure 8. device orientation in chip carrier (i) measured from centerline of sprocket hole to centerline of pocket. (ii) cumulative tolerance of 10 sprocket holes is 0.20. (iii) measured from centerline of sprocket hole to centerline of pocket. (iv) other material available. dimensions are in millimeters. ao 3.35 0.10 bo 5.35 0.10 ko 1.20 0.10 f 5.50 0.10 p1 8.00 0.10 w 12.00 0.10 pin 1 index area
sensors 14 freescale semiconductor, inc. mpl115a2 package dimensions case 2015-02 issue a lga package
sensors freescale semiconductor, inc. 15 mpl115a2 table 6. revision history revision number revision date description of changes 8 06/2012 ? updated graphic on page 1, section 2.2 oper ating characteristics: ref 7: conversion time: changed typ from 3.0 to 1.6, se ction 3.0 overview of function s/operation: reading coefficient data deleted statement that reading of coeffi cients may be executed only once, table 2: added size (bits) column in table, added new section 3.4 i 2 c device read/write operations 9 10/2012 ? changed example binary format definitions b1 signed from: 7 to: 13, added f 11 to coeff b1, b2 and c12 on page 6. ? removed mpl115a2t2 from ordering table.
document number: mpl115a2 rev. 9 02/2013 how to reach us: home page: freescale.com web support: freescale.com/support information in this document is provided solely to enable system and software implementers to use freescale products. there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. freescale reserves the right to make changes without further notice to any products herein. freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does freescale assume any liability arising out of the app lication or use of an y product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale data sheets and/or specifications can and do vary in differen t applications, and actual performance may vary over time. all operating parameters, including ?typicals,? must be validated for each customer application by customer?s technica l experts. freescale does not convey any license under its patent rights nor the rights of others. freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. freescale, the freescale logo, altivec, c-5, codetest, codewarrior, coldfire, c-ware, energy efficient solutions logo, kinetis, mobilegt, powerquicc, processor expert, qoriq, qorivva, starcore, symphony, and vortiqa are trademarks of freescale semiconductor, inc., reg. u.s. pat. & tm. off. airfast, beekit, beestack, coldfire+, corenet, flexis, magniv, mxc, platform in a package, qoriq qonverge, quicc engine, ready play, safeassure, smartmos , turbolink, vybrid, and xtrinsic are trademarks of freescale semiconductor, inc. all other product or service names are the property of their respective owners. ? 2013 freescale semiconductor, inc.

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